Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Hexion EPON F-862 Bisphenol F Epoxy Resin

Hexion EPON F-862 is a low-viscosity Bisphenol F epoxy resin offering superior chemical resistance, thermal stability, and adhesion. Ideal for high-performance composites, coatings, and electrical encapsulation, it cures rapidly with amines or anhydrides. Its low halogen content and excellent flow properties support demanding industrial applications across aerospace, electronics, and protective coatings.
  • hexion epon f 862 bisphenol f epoxy resin_ba856dd9
  • hexion epon f 862 bisphenol f epoxy resin_ba856dd9

Features Of Hexion EPON F-862 Bisphenol F Epoxy Resin

  1. Low viscosity liquid resin enabling excellent wet-out and processability in composites and coatings.

  2. High reactivity with amines and anhydrides, supporting fast cure kinetics and reduced cycle times.

  3. Superior chemical resistance, particularly to acids, alkalis, and solvents, compared to standard Bisphenol A epoxy resins.

  4. Enhanced thermal stability and glass transition temperature (Tg) in cured networks.

  5. Low chlorine content contributing to improved electrical insulation properties and reduced corrosion risk.

Typical Applications Of Hexion EPON F-862 Bisphenol F Epoxy Resin

  1. High-performance composite matrices for aerospace and wind energy blade manufacturing.

  2. Chemical-resistant tank linings and industrial flooring systems.

  3. Electrical encapsulation and insulating varnishes for transformers and motors.

  4. Adhesives and structural bonding formulations requiring elevated temperature performance.

  5. UV-stable protective coatings for marine and offshore infrastructure.

Specifications Of Hexion EPON F-862 Bisphenol F Epoxy Resin

Chemical TypeBisphenol F-based diglycidyl ether epoxy resin
Product FormClear, low-viscosity liquid
AppearancePale yellow to water-white, transparent liquid
Epoxy Equivalent Weight (EEW)170–185 g/eq
Viscosity at 25°C12,000–16,000 cP
Chlorine Content≤ 700 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsComposites, protective coatings, electrical insulation, high-performance adhesives


Hexion EPON F-862 Bisphenol F Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What are the key advantages of EPON F-862 compared to bisphenol A-based epoxy resins?

A: EPON F-862 offers lower viscosity and higher functionality than standard bisphenol A epoxies, enabling improved wetting of fillers and reinforcements, enhanced crosslink density in cured systems, and better performance in high-solids or solvent-free formulations.


Q2: Is EPON F-862 suitable for use in electrical encapsulation and potting applications?

A: Yes — its low ionic impurity content, good dielectric properties, and ability to achieve high glass transition temperatures after curing make it well-suited for demanding electrical insulation and encapsulation applications, especially where thermal stability and moisture resistance are critical.


Q3: How does EPON F-862 perform in corrosion-resistant coating systems?

A: Due to its higher aromatic content and tighter crosslinked network, EPON F-862 contributes to improved chemical resistance and barrier properties in protective coatings—particularly when combined with appropriate amine or phenalkamine hardeners for industrial and marine environments.


Q4: Can EPON F-862 be blended with other epoxy resins?

A: Yes — it is fully miscible with most liquid and solid bisphenol A epoxies, as well as novolac and cycloaliphatic epoxies, allowing formulators to tailor viscosity, reactivity, and final cure properties without phase separation concerns.



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