High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and low dissipation factor.
Good thermal stability with glass transition temperature (Tg) of 115–120°C after post-cure at 150°C.
Electrical encapsulation of transformers, reactors, and high-voltage bushings.
Structural bonding and composite matrix resin for wind turbine blade components.
Insulating coatings and potting compounds for automotive power electronics modules.
Core material in printed circuit board (PCB) laminates and prepreg systems.
Repair and refurbishment resins for industrial machinery housings and marine equipment.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Transparent to slightly hazy, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China