High thermal stability with glass transition temperature (Tg) typically above 130 °C after full curing.
Excellent chemical resistance to acids, alkalis, and solvents in demanding industrial environments.
Superior electrical insulation properties, making it ideal for high-reliability electronic encapsulation.
Low ionic impurity content, ensuring minimal corrosion risk in semiconductor and microelectronic applications.
Consistent molecular weight distribution for reliable reactivity and predictable gel time control.
Encapsulation of integrated circuits (ICs) and power modules in automotive electronics.
Underfill material for flip-chip and wafer-level packaging in advanced semiconductor assembly.
Matrix resin for high-performance printed circuit board (PCB) laminates requiring flame retardancy.
Adhesive formulation for bonding ceramic substrates and metal lead frames in LED packaging.
Dielectric coating for sensors and MEMS devices operating under elevated temperature conditions.
| Chemical Type | Cresol-formaldehyde novolac epoxy resin |
| Product Form | Pale yellow to light amber solid pellets or flakes |
| Appearance | Homogeneous, free-flowing solid with no visible impurities |
| Epoxy Equivalent Weight (EEW) | 170–185 g/eq |
| Softening Point | 85–95 °C (ASTM D36) |
| Color (Gardner Scale) | ≤3 |
| Chlorine Content | ≤400 ppm |
| Volatiles (1 hr @ 150 °C) | ≤0.5 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China