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High thermal stability with glass transition temperature (Tg) typically above 130 °C after full curing.
Excellent chemical resistance to acids, alkalis, and solvents in demanding industrial environments.
Superior electrical insulation properties, making it ideal for high-reliability electronic encapsulation.
Low ionic impurity content, ensuring minimal corrosion risk in semiconductor and microelectronic applications.
Consistent molecular weight distribution for reliable reactivity and predictable gel time control.
Encapsulation of integrated circuits (ICs) and power modules in automotive electronics.
Underfill material for flip-chip and wafer-level packaging in advanced semiconductor assembly.
Matrix resin for high-performance printed circuit board (PCB) laminates requiring flame retardancy.
Adhesive formulation for bonding ceramic substrates and metal lead frames in LED packaging.
Dielectric coating for sensors and MEMS devices operating under elevated temperature conditions.
| Chemical Type | Cresol-formaldehyde novolac epoxy resin |
| Product Form | Pale yellow to light amber solid pellets or flakes |
| Appearance | Homogeneous, free-flowing solid with no visible impurities |
| Epoxy Equivalent Weight (EEW) | 170–185 g/eq |
| Softening Point | 85–95 °C (ASTM D36) |
| Color (Gardner Scale) | ≤3 |
| Chlorine Content | ≤400 ppm |
| Volatiles (1 hr @ 150 °C) | ≤0.5 wt% |
Q1: What distinguishes ECN9511 from standard bisphenol-A epoxy resins?
A: ECN9511 is a cresol-formaldehyde novolac-type epoxy resin, offering significantly higher functionality and thermal stability compared to conventional bisphenol-A epoxies. Its multi-epoxy structure enables enhanced crosslink density, resulting in superior heat resistance, chemical resistance, and mechanical rigidity—particularly valuable in high-performance composites and electronic encapsulation.
Q2: Is ECN9511 suitable for use in electronic encapsulation or underfill applications?
A: Yes—ECN9511 is widely selected for electronic packaging due to its low ionic impurity content, excellent adhesion to substrates like silicon and copper, and strong resistance to thermal cycling and moisture ingress after curing. It is commonly formulated into underfills, glob tops, and wafer-level encapsulants where dimensional stability and long-term reliability are critical.
Q3: What types of curing agents are typically used with ECN9511?
A: ECN9511 is compatible with a range of latent and thermally activated curing agents, including aromatic amines (e.g., DICY derivatives), phenolic novolacs, and imidazole-based catalysts. Selection depends on the desired cure profile, glass transition temperature, and end-use requirements—such as fast-cure for high-throughput electronics assembly or extended pot life for composite processing.
Q4: How should ECN9511 be handled and stored to maintain performance?
A: Store ECN9511 in tightly sealed containers under dry, cool conditions (preferably below 25 °C) and protected from moisture and direct sunlight. Prolonged exposure to humidity may cause partial pre-reaction or viscosity increase. Prior to use, gentle warming to 40–50 °C may be applied to improve handling—avoid excessive heat or prolonged heating above 60 °C.
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E-mail: wangxingqiang@ericwchem.com
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