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High purity bisphenol-A based liquid epoxy resin with low ionic impurity content.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling and processing.
Superior electrical insulation properties and thermal stability up to 130°C.
Consistent batch-to-batch performance meeting stringent industrial quality control standards.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance laminating resins for printed circuit board (PCB) substrates.
Structural adhesives in aerospace and automotive composite bonding.
Coating systems for corrosion-resistant industrial tank linings and pipe coatings.
Composite matrix resin for fiber-reinforced wind turbine blade components.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
