High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Low viscosity (12,000–14,000 cP at 25°C) enabling excellent processability and filler wetting.
Superior chemical resistance to alkalis, diluted acids, and solvents after proper curing.
Excellent adhesion to metals, glass, and composite substrates without surface priming.
Optimized for ambient and elevated temperature curing systems using standard amine or anhydride hardeners.
Electrical encapsulation and potting of transformers, reactors, and power electronics.
Structural adhesive formulations for aerospace and automotive bonding applications.
High-performance composite matrix resin for carbon fiber and fiberglass laminates.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
UV-stable flooring and decorative terrazzo systems requiring low shrinkage and high gloss retention.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Epoxide Content (wt%) | 17.5–18.3% |
| Volatile Matter (max) | 0.2% (by weight) |
| Chloride Content (max) | 150 ppm |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China