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High purity bisphenol A-based epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.
Excellent thermal stability and low volatility, supporting high-temperature processing and extended pot life.
Superior adhesion to metals, composites, and cured thermosets—ideal for structural bonding and coating systems.
Low ionic chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation and aerospace applications.
Optimized molecular weight distribution for balanced viscosity, mechanical strength, and crosslink density.
Electrical insulation and potting compounds for transformers, reactors, and high-voltage equipment.
Structural adhesives in automotive and rail vehicle assembly, especially for aluminum and CFRP bonding.
High-performance protective coatings for offshore platforms, chemical storage tanks, and industrial flooring.
Matrix resin in filament-wound composite pressure vessels and wind turbine blade components.
Prepreg systems for aerospace-grade laminates requiring low outgassing and high glass transition temperature (Tg).
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous, free of gels or suspended particles |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chlorine Content (Total) | ≤ 800 ppm |
| Softening Point | 12–16°C |
| Color (Gardner Scale) | ≤ 2 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
