High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and impregnation.
Superior thermal stability with glass transition temperature (Tg) of cured system ≥125°C.
Low chloride content (<500 ppm), ensuring high electrical insulation performance.
Electrical encapsulation and potting compounds for power electronics and transformers.
Structural adhesive formulations for aerospace composite bonding.
High-performance laminating resins for printed circuit board (PCB) prepregs.
Wind turbine blade matrix resin in carbon fiber reinforced systems.
High-voltage insulators and bushing casting applications.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | <500 ppm |
| Softening Point | 12–15°C |
| Volatiles Content | <0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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