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High-purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Optimized viscosity for efficient processing in casting, laminating, and potting applications.
Superior electrical insulation properties and thermal stability after curing.
Consistent batch-to-batch performance meeting stringent JIS K 6911 and ASTM D1654 standards.
Electrical insulators and high-voltage bushings.
Encapsulation and potting of electronic components and power modules.
Laminates for printed circuit boards (PCBs) requiring UL 94 V-0 rated flame retardancy.
Structural adhesives in aerospace and automotive composite assemblies.
Casting resins for precision industrial tooling and dielectric transformers.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, homogeneous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 mPa·s |
| Chloride Content | ≤ 750 ppm |
| Softening Point | 12–15°C |
| Storage Stability | ≥ 12 months at 5–30°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
