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High-purity, low-chloride bisphenol-A diglycidyl ether epoxy resin for enhanced electrical insulation and hydrolytic stability.
Consistent molecular weight distribution ensures excellent reproducibility in formulation and processing.
Low viscosity (10–14 Pa·s at 25 °C) enables easy handling, efficient mixing with hardeners, and superior wetting of fillers and reinforcements.
Excellent adhesion to metals, composites, and cured polymer substrates across diverse environmental conditions.
Compatible with a broad range of amine, anhydride, and phenolic curing agents for tailored thermal and mechanical performance.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
Structural adhesives in aerospace and automotive composite bonding.
High-performance coatings for corrosion protection on steel infrastructure and marine equipment.
Matrix resin for carbon fiber and glass fiber reinforced laminates in wind turbine blades and sporting goods.
Underfill and molding compounds in semiconductor packaging and microelectronics assembly.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Liquid |
| Appearance | Pale yellow, clear to slightly hazy liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25 °C) | 10–14 Pa·s |
| Chloride Content | ≤ 500 ppm |
| Color (Gardner) | ≤ 3 |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
