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High-purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent thermal stability and long pot life for controlled processing.
Superior adhesion to metals, composites, and cured polymer substrates.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling and impregnation.
Consistent reactivity profile suitable for precise stoichiometric formulation with amine or anhydride hardeners.
Electrical encapsulation and potting compounds for power electronics.
Structural adhesives in aerospace and automotive bonding applications.
Matrix resin for carbon fiber and glass fiber reinforced composites.
High-performance coatings for corrosion-resistant industrial linings.
Prepregs and filament winding systems requiring low volatility and high Tg potential.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, composites, structural adhesives, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
