High reactivity with amine hardeners, enabling rapid gelation and short cure cycles.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated temperature conditions.
Low viscosity (8,000–12,000 cP at 25°C) for easy processing, impregnation, and air bubble release.
Superior chemical resistance to alkalis, solvents, and mild acids after full cure.
Low chloride content (<0.05 wt%), ensuring compatibility with sensitive electronic encapsulation applications.
Electrical insulation and potting compounds for power electronics and transformers.
Structural adhesives in automotive and aerospace composite bonding.
Prepreg matrix resin for carbon fiber and glass fiber reinforced laminates.
Coating systems for corrosion protection of steel infrastructure and pipelines.
Casting resins for high-voltage insulators and bushings.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | ≤0.05 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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