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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated temperature conditions.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release in casting and potting applications.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to diluted acids, alkalis, and solvents after full cure.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural bonding in automotive electronics and power module assemblies.
Casting and laminating for medium-voltage switchgear components.
Matrix resin in glass-fiber reinforced composites for industrial enclosures.
Underfill and conformal coating for PCB protection in harsh-environment electronics.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, potting, casting, and structural bonding |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
