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High-purity bisphenol-F-based epoxy resin with low chloride content for enhanced electrical insulation.
Excellent thermal stability and glass transition temperature (Tg) suitable for elevated-temperature curing processes.
Low viscosity at processing temperatures, enabling easy handling, mixing, and impregnation into fiber reinforcements.
Superior chemical resistance to alkalis, solvents, and mild acids in cured form.
Consistent batch-to-batch performance and stringent quality control per ISO 9001 manufacturing standards.
Electrical encapsulation and potting compounds for high-voltage transformers and insulators.
Structural adhesives in aerospace composite assemblies requiring thermal and dimensional stability.
Matrix resin for filament-wound pressure vessels and cryogenic storage tanks.
High-performance coatings for corrosion-resistant linings in chemical process equipment.
Prepreg systems for carbon fiber reinforced laminates used in defense and motorsport components.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of sediment or haze |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Primary Applications | High-performance composites, electrical insulation, structural adhesives |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
