Highly reactive liquid bisphenol-A epoxy resin with low viscosity for excellent processability.
Optimized molecular weight distribution ensuring consistent reactivity and cure profile.
Low chloride content (< 500 ppm) supporting high electrical insulation performance.
Excellent compatibility with standard amine and anhydride curing agents.
Stable shelf life under recommended storage conditions (unopened, 25°C or below).
Electrical encapsulation and potting compounds for transformers and sensors.
High-voltage insulating varnishes and impregnating resins for motor windings.
Structural adhesives requiring thermal stability and chemical resistance.
Prepregs and laminates in printed circuit board (PCB) base materials.
Composite matrices for aerospace and industrial tooling applications.
| Chemical Type | Liquid bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, encapsulation, prepregs, adhesives |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China