High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent mechanical strength and thermal stability after full cure, supporting demanding service environments.
Low viscosity at ambient temperature, enabling easy handling, degassing, and impregnation of fibrous reinforcements.
Good compatibility with common epoxy modifiers and fillers, facilitating formulation flexibility.
Consistent batch-to-batch quality with strict control over epoxide equivalent weight (EEW) and chlorine content.
Electrical encapsulation and potting compounds for power modules and high-voltage components.
Structural adhesives in automotive and aerospace composite bonding applications.
Prepreg matrix resin for carbon fiber and glass fiber reinforced laminates.
Wind turbine blade structural adhesives and shear web bonding systems.
High-performance coating binders for corrosion-resistant industrial floor and tank linings.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, homogeneous liquid without sediment |
| Epoxide Equivalent Weight (EEW) | 182–188 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chlorine Content (Total) | ≤ 900 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Structural composites, electrical encapsulation, high-performance adhesives |
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E-mail: wangxingqiang@ericwchem.com
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