Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kumho Yangnong YN-1827 Epoxy Resin

KumhoYangnongYN-1827EpoxyResinisahigh-performancebrominatedepoxyresinfromtheYNseries,designedforexcellentflameretardancy,electricalinsulation,andthermalstability.IdealforPCBprepregs,laminates,andadvancedelectronicspackaging,itholdsUL94V-0ratingwithlowsmokeandhalogen-freecompatibility.Ensuresreliabilityinhigh-densityinterconnectapplicationswhilemeetingstrictRoHSandIEC61249standards.
  • kumho yangnong yn 1827 epoxy resin_f1c853b4
  • kumho yangnong yn 1827 epoxy resin_f1c853b4

Features Of Kumho Yangnong YN-1827 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent mechanical strength and thermal stability after full cure, supporting demanding service environments.

  3. Low viscosity at ambient temperature, enabling easy handling, degassing, and impregnation of fibrous reinforcements.

  4. Good compatibility with common epoxy modifiers and fillers, facilitating formulation flexibility.

  5. Consistent batch-to-batch quality with strict control over epoxide equivalent weight (EEW) and chlorine content.

Typical Applications Of Kumho Yangnong YN-1827 Epoxy Resin

  1. Electrical encapsulation and potting compounds for power modules and high-voltage components.

  2. Structural adhesives in automotive and aerospace composite bonding applications.

  3. Prepreg matrix resin for carbon fiber and glass fiber reinforced laminates.

  4. Wind turbine blade structural adhesives and shear web bonding systems.

  5. High-performance coating binders for corrosion-resistant industrial floor and tank linings.

Specifications Of Kumho Yangnong YN-1827 Epoxy Resin

Chemical TypeBisphenol-A based liquid epoxy resin
Product FormClear to pale yellow low-viscosity liquid
AppearanceTransparent, homogeneous liquid without sediment
Epoxide Equivalent Weight (EEW)182–188 g/eq
Viscosity (25°C)12,000–16,000 cP
Chlorine Content (Total)≤ 900 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsStructural composites, electrical encapsulation, high-performance adhesives


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