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High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace composite bonding and metal-to-composite joints.
Matrix resin in fiber-reinforced laminates for printed circuit board (PCB) substrates.
Coating formulations for corrosion-resistant tank linings and industrial flooring.
Wind turbine blade adhesive and structural core infusion resins.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, amber viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Primary Applications | Electrical insulation, structural composites, high-performance adhesives |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
