Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Shikoku C11Z-CNS Epoxy Resin

Shikoku C11Z-CNS Epoxy Resin is a high-performance bisphenol-F-based epoxy resin from Shikoku Chemicals’ C11Z series, engineered for demanding electrical insulation and composite applications. It offers excellent thermal stability, low viscosity, superior adhesion, and outstanding dielectric properties—ideal for encapsulation, laminates, and aerospace-grade composites requiring CNS compliance and consistent batch-to-batch reliability.
  • shikoku c11z cns epoxy resin_002f9084
  • shikoku c11z cns epoxy resin_002f9084

Features Of Shikoku C11Z-CNS Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and fiber-reinforced substrates.

  3. Low viscosity enables easy handling, degassing, and impregnation of complex fiber architectures.

  4. Superior thermal stability with glass transition temperature (Tg) exceeding 180 °C post-cure.

  5. Low chloride content ensures enhanced corrosion resistance in demanding structural applications.

Typical Applications Of Shikoku C11Z-CNS Epoxy Resin

  1. Aerospace composite parts including winglets, fuselage panels, and interior components.

  2. High-performance wind turbine blade matrices requiring fatigue resistance and dimensional stability.

  3. Electrical insulation systems for high-voltage transformers and dry-type reactors.

  4. Automotive structural adhesives and carbon fiber reinforced polymer (CFRP) body modules.

  5. Industrial tooling and mandrels for precision composite manufacturing processes.

Specifications Of Shikoku C11Z-CNS Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear to pale yellow low-viscosity liquid
AppearanceTransparent, homogeneous liquid at 25 °C
Epoxy Equivalent Weight (EEW)178–184 g/eq
Viscosity (25 °C)12,000–16,000 mPa·s
Chloride Content≤ 500 ppm
Volatiles Content≤ 0.3 wt%
Storage Stability12 months at ≤ 25 °C in sealed original packaging


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