High reactivity with standard amine and anhydride hardeners for rapid cure development.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (4,500–5,500 cP at 25°C) enabling easy processing and impregnation.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chlorine content (<0.08 wt%) supporting high electrical insulation performance.
Electrical encapsulation and potting of transformers, reactors, and power electronics.
Structural adhesive formulations for aerospace composite bonding.
Matrix resin in filament-wound pressure vessels and FRP piping systems.
High-performance coating binders for corrosion-resistant industrial linings.
Prepreg and infusion resins for wind turbine blade manufacturing.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 4,500–5,500 cP |
| Chloride Content | ≤0.08 wt% |
| Softening Point | 12–16°C |
| Primary Applications | Electrical insulation, structural composites, high-performance adhesives |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China