High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and engineered plastics without primer pretreatment.
Low viscosity (3,500–4,500 mPa·s at 25°C) enabling easy handling, impregnation, and void-free processing.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of approx. 130–140°C after full cure.
Electrical encapsulation of power modules, IGBTs, and high-voltage sensors.
Structural bonding in automotive electronics and EV battery pack components.
Insulating potting compound for industrial control systems and railway signaling equipment.
Matrix resin for filament-wound composite pressure vessels and lightweight structural parts.
Underfill and glob-top material for semiconductor packaging and MEMS device protection.
| Chemical Type | Diglycidyl ether of bisphenol-F (BPF-type epoxy) |
| Product Form | Liquid resin |
| Appearance | Pale yellow, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity (25°C) | 3,500–4,500 mPa·s |
| Chloride Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability (25°C) | ≥ 12 months in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China