Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Mitsui EPOKEY 505-15 Epoxy Resin

Mitsui EPOKEY 505-15 is a high-performance liquid epoxy resin from Mitsui Chemicals’ EPOKEY series offering excellent adhesion thermal stability and low viscosity for composites coatings and electronic encapsulation applications widely used in aerospace automotive and PCB manufacturing.
  • mitsui epokey 505 15 epoxy resin_779438db
  • mitsui epokey 505 15 epoxy resin_779438db

Features Of Mitsui EPOKEY 505-15 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and engineered plastics without primer pretreatment.

  3. Low viscosity (3,500–4,500 mPa·s at 25°C) enabling easy handling, impregnation, and void-free processing.

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good thermal stability with glass transition temperature (Tg) of approx. 130–140°C after full cure.

Typical Applications Of Mitsui EPOKEY 505-15 Epoxy Resin

  1. Electrical encapsulation of power modules, IGBTs, and high-voltage sensors.

  2. Structural bonding in automotive electronics and EV battery pack components.

  3. Insulating potting compound for industrial control systems and railway signaling equipment.

  4. Matrix resin for filament-wound composite pressure vessels and lightweight structural parts.

  5. Underfill and glob-top material for semiconductor packaging and MEMS device protection.

Specifications Of Mitsui EPOKEY 505-15 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F (BPF-type epoxy)
Product FormLiquid resin
AppearancePale yellow, transparent liquid
Epoxy Equivalent Weight (EEW)178–186 g/eq
Viscosity (25°C)3,500–4,500 mPa·s
Chloride Content≤ 700 ppm
Volatiles Content≤ 0.3 wt%
Storage Stability (25°C)≥ 12 months in sealed container


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