High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic chloride content (<0.05%) for enhanced electrical insulation performance.
Optimized viscosity (12,000–16,000 cP at 25°C) enabling easy processing in solvent-free and high-solids formulations.
Superior adhesion to metals, glass, and composites after proper curing with standard amine or anhydride hardeners.
Low color value (APHA ≤15) ensuring minimal yellowing in clear-coat and optical-grade applications.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
High-performance laminating resins for printed circuit board (PCB) prepregs and copper-clad laminates.
Structural adhesive systems used in aerospace composite bonding and automotive lightweight assemblies.
UV- and thermal-curable coatings for metal substrates requiring chemical resistance and gloss retention.
Matrix resin for filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear, amber viscous liquid |
| Appearance | Homogeneous, transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | ≤0.05 wt% |
| Color (APHA) | ≤15 |
| Softening Point | Not applicable (liquid at room temperature) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China