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High reactivity with amine and anhydride hardeners for rapid cure development.
Excellent adhesion to metals, composites, and cured epoxy substrates.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and impregnation.
Superior chemical resistance to alkalis, diluted acids, and solvents after full cure.
Good thermal stability with glass transition temperature (Tg) up to 125°C in optimized formulations.
Structural adhesives for aerospace and automotive bonding.
Matrix resin for carbon fiber and fiberglass composites.
Electrical encapsulation and potting compounds for power electronics.
High-performance coating systems for industrial steel protection.
Tooling resins for mold-making and prototype fabrication.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 18–22°C |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
