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High thermal stability and excellent glass transition temperature (Tg) for demanding high-temperature applications.
Superior chemical resistance, especially to acids, alkalis, and organic solvents.
Low ionic impurity content, ensuring high electrical insulation performance and reliability in electronic encapsulation.
Excellent adhesion to metals, ceramics, and reinforced substrates without requiring surface priming.
Controlled molecular weight distribution enabling consistent reactivity and predictable curing behavior.
Encapsulation and potting of semiconductor devices and integrated circuits (ICs).
Manufacturing of high-performance printed circuit board (PCB) laminates and prepregs.
Structural adhesives for aerospace and automotive composite bonding.
Electrical insulating varnishes and coil coatings for motors and transformers.
High-reliability molding compounds for power electronics modules.
| Chemical Type | Cresol-formaldehyde novolac epoxy resin |
| Product Form | Pale yellow to amber solid pellets or flakes |
| Appearance | Free-flowing, homogeneous solid with no visible impurities |
| Epoxy Equivalent Weight (EEW) | 180–195 g/eq |
| Softening Point | 85–95 °C |
| Viscosity (150 °C, molten) | 8,000–12,000 mPa·s |
| Chlorine Content | < 800 ppm |
| Volatile Matter | < 0.5 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
