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Low-viscosity liquid epoxy resin enabling excellent flow and wetting in demanding formulations.
High purity with low chloride content, supporting superior electrical insulation properties.
Compatible with a broad range of amine, anhydride, and catalytic curing agents for flexible formulation design.
Good hydrolytic stability and resistance to moisture absorption during storage and processing.
Consistent batch-to-batch performance meeting stringent quality control standards for industrial use.
Electrical potting and encapsulation compounds for transformers, sensors, and power modules.
High-voltage insulating varnishes and impregnating resins for motor and generator windings.
Structural adhesives requiring low shrinkage and high dielectric strength.
Composite matrix resins for aerospace and electrical-grade laminates.
Specialty coatings for corrosion-resistant and electrically insulated substrates.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, potting, impregnation, and high-performance adhesives |
Q1: What is the primary function of HELoxy 11 in epoxy formulations?
A: HELoxy 11 is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising final crosslink density or thermal performance.
Q2: Is HELoxy 11 compatible with common amine and anhydride curing agents?
A: Yes, HELoxy 11 exhibits broad compatibility with aliphatic and aromatic amines, as well as cyclic anhydrides, and participates fully in the epoxy curing reaction due to its terminal glycidyl functionality.
Q3: How does HELoxy 11 compare to non-reactive diluents in terms of VOC and film properties?
A: Unlike non-reactive diluents, HELoxy 11 is low-VOC and becomes chemically bound into the polymer network, helping maintain mechanical integrity, chemical resistance, and reduced leaching potential in the cured system.
Q4: Can HELoxy 11 be used in high-solids or solvent-free epoxy coatings and adhesives?
A: Yes, it is commonly employed in high-solids and 100% solids epoxy systems to achieve target application viscosities while supporting good pot life and film formation characteristics.
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