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High-purity, low-chloride bisphenol-A based epoxy resin for enhanced electrical insulation performance.
Optimized molecular weight distribution for excellent flow control and reduced gel time in casting applications.
Low viscosity at processing temperatures (130–150°C), enabling easy impregnation of fine-fiber composites and windings.
Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure with standard amine hardeners.
Consistent batch-to-batch reproducibility certified under ISO 9001 and ISO 14001 manufacturing systems.
High-voltage dry-type transformer encapsulation and potting.
Insulating coatings for motor stators and generator windings.
Electrical bushings and insulators for switchgear and substation equipment.
Structural bonding in power electronics housings requiring UL 94 V-0 rated flame resistance.
Core material for high-reliability encapsulated sensors and current transformers.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Light-amber viscous liquid |
| Appearance | Clear, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 188–194 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 750 ppm |
| Softening Point | 10–14°C |
| Volatiles Content | ≤ 0.3 wt% |
Q1: What is the primary function of Shikoku 2P4MHZ-PW in epoxy formulations?
A: Shikoku 2P4MHZ-PW is a specialty polyether-modified amine hardener designed to enhance flexibility, impact resistance, and low-temperature cure performance in bisphenol-A or bisphenol-F based epoxy systems.
Q2: Is this product suitable for food-contact or potable water applications?
A: Shikoku 2P4MHZ-PW is not pre-qualified for direct food-contact or potable water applications. Formulators must conduct full regulatory evaluation—including extraction testing and compliance verification—based on final cured system composition and intended use conditions.
Q3: How does 2P4MHZ-PW compare to conventional aliphatic amines in terms of pot life and reactivity?
A: It offers extended pot life at ambient temperatures compared to standard aliphatic amines, while maintaining reliable reactivity under mild thermal curing conditions (e.g., 60–80 °C). This balance supports improved processing window without sacrificing final network development.
Q4: Can it be used in high-solids or solvent-free epoxy coatings?
A: Yes—its low volatility and favorable viscosity profile make it well-suited for high-solids and 100% solids epoxy coating and adhesive formulations, contributing to reduced VOC content and improved film formation.
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E-mail: wangxingqiang@ericwchem.com
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