Highly reactive bisphenol-A based liquid epoxy resin with low viscosity for excellent processability.
Superior adhesion to metals, composites, and cured polymer substrates under ambient and elevated cure conditions.
Excellent chemical resistance to alkalis, dilute acids, and common solvents after full crosslinking.
Consistent batch-to-batch quality certified to ISO 9001 manufacturing standards.
Low chloride content (< 500 ppm) ensuring compatibility in high-reliability electronic encapsulation applications.
Structural adhesives for automotive and aerospace bonding assemblies.
Electrical encapsulants and potting compounds for PCBs and power modules.
High-performance composite matrix resin for carbon fiber and glass fiber reinforcements.
Protective coatings for industrial steel and concrete infrastructure.
Formulation base for specialty casting resins used in tooling and mold making.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China