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Highly reactive liquid epoxy resin with low viscosity for excellent processability and wetting.
Superior thermal stability and chemical resistance after curing with appropriate hardeners.
Consistent molecular weight distribution ensuring reproducible performance in formulation.
Low chloride content supporting high electrical insulation properties in electronic applications.
Compatible with a broad range of amine, anhydride, and phenolic curing agents.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance laminating resins for printed circuit board (PCB) prepregs.
Structural adhesives requiring elevated temperature resistance and toughness.
Composite matrix resins for aerospace and wind energy components.
Coatings and linings for corrosion-resistant industrial equipment.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid at room temperature |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at 25°C) |
| Key Features | Low viscosity, high reactivity, low ionic impurities, excellent dielectric strength |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
