High reactivity with amine and anhydride hardeners, enabling rapid gelation and short cure cycles.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated temperature conditions.
Low viscosity (800–1,200 cP at 25°C) for easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to weak acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and medium-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and metal-to-composite joints.
High-performance potting compounds for automotive sensors and power electronics modules.
Matrix resin in filament-wound pressure vessels and FRP piping systems.
Base resin for specialty coatings requiring thermal stability and corrosion protection.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 800–1,200 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
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