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High reactivity with amine and anhydride hardeners for rapid cure development.
Excellent adhesion to metals, composites, and cured epoxy substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to alkalis, dilute acids, and solvents after full cure.
Electrical encapsulation and potting of transformers, reactors, and busbar systems.
Structural adhesive formulations for aerospace composite bonding.
High-performance laminating resin for printed circuit board (PCB) prepregs.
Insulating coatings and varnishes for rotating electrical machinery.
Matrix resin in filament-wound pressure vessels and piping systems.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 168–174 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Chloride Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
