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Highly reactive latent imidazole accelerator—enables precise control over cure onset and pot life.
Excellent thermal stability in uncured state, supporting long-term storage and high-temperature processing windows.
Enables low-temperature curing (120–150 °C) without compromising final crosslink density or glass transition temperature.
Delivers superior electrical insulation properties and low ionic impurity content for electronic-grade reliability.
Compatible with standard bisphenol-A and novolac epoxy resins, facilitating seamless formulation integration.
Encapsulants and glob-tops for semiconductor devices and IC packages.
Prepregs and laminates in high-performance printed circuit boards (PCBs).
Underfill materials for flip-chip and wafer-level packaging.
Adhesives for microelectronics assembly requiring fine-pitch bonding and low stress.
Structural composites in aerospace and automotive electronics housings.
| Chemical Type | Latent imidazole accelerator (2-ethyl-4-methylimidazole derivative) |
| Product Form | Pale yellow to light amber crystalline solid |
| Appearance | Free-flowing granules or fine powder |
| Primary Applications | Thermally activated epoxy curing agent for electronics encapsulation and laminates |
| Key Features | Latent reactivity, low volatility, halogen-free formulation |
| Benefits | Extended shelf life (>12 months at 25 °C), minimal bloom, high Tg after cure |
| Recommended Storage | Sealed container, dry conditions, 5–25 °C |
| Handling Precaution | Use in well-ventilated area; avoid inhalation of dust and skin contact |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
