Highly reactive latent curing agent based on 2-ethyl-4-methylimidazole (2E4MZ) for epoxy systems.
Enables precise processing control with extended pot life at ambient temperature and rapid cure onset above 80 °C.
Delivers excellent thermal stability and high glass transition temperature (Tg) in cured networks.
Provides superior adhesion to metals, composites, and engineered plastics without surface priming.
Low volatility and low odor formulation, supporting safer industrial handling and compliance with VOC-restricted environments.
Aerospace composite bonding and structural adhesive formulations.
Electronics encapsulation and underfill materials for advanced packaging.
High-performance wind turbine blade adhesives and matrix resins.
Automotive powertrain components requiring thermal cycling resistance.
Prepreg and infusion resin systems for carbon fiber reinforced polymers (CFRP).
| Chemical Type | Latent imidazole-based curing agent |
| Product Form | Pale yellow to light amber crystalline solid |
| Appearance | Free-flowing crystalline powder |
| Melting Point | 75–79 °C |
| Active Hydrogen Equivalent Weight | ≈110 g/eq |
| Storage Stability | ≥12 months at ≤25 °C in sealed container |
| Solubility | Readily soluble in common epoxy diluents (e.g., DGEBA, glycidyl ethers) |
| Key Features | Latent reactivity, low activation energy, high Tg promotion |
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E-mail: wangxingqiang@ericwchem.com
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