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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility for safe handling and processing.
Superior adhesion to metals, composites, and cured polymer substrates.
Low chloride content (< 500 ppm) ensuring reduced corrosion risk in electronic encapsulation.
Optimized viscosity (12,000–14,000 cP at 25°C) for efficient dispensing and impregnation.
Electrical insulation and potting compounds for power electronics and transformers.
Structural adhesive formulations for aerospace composite bonding.
Prepreg matrix resin for high-performance carbon fiber laminates.
Coating systems requiring chemical resistance and UV stability.
Encapsulants for LED modules and semiconductor packaging.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Volatile Matter | ≤ 0.5 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
