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High-purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content for compliant processing.
Optimized melt viscosity for efficient handling in extrusion, compression molding, and powder coating applications.
Superior adhesion to metals, glass, and composites without requiring surface priming.
Enhanced chemical resistance to alkalis, dilute acids, and solvents after full cure.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
Powder coatings for corrosion protection of steel infrastructure and automotive components.
Composite matrix resin for filament-wound pressure vessels and structural wind blade adhesives.
Prepreg systems in aerospace-grade laminates requiring high glass transition temperature (Tg).
High-performance adhesives for electronics assembly and semiconductor packaging substrates.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Off-white to light tan solid flakes |
| Appearance | Free-flowing crystalline flakes |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Melting Point | 105–115 °C |
| Softening Point | 85–95 °C (ASTM E28) |
| Volatiles Content | <0.3 wt% (105 °C, 2 h) |
| Key Features | Low chloride content, high purity, excellent storage stability |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
