High reactivity with amine and anhydride hardeners for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of ~125°C after full cure.
Electrical encapsulation and potting of transformers, reactors, and high-voltage components.
Insulating varnishes and impregnating resins for motors, generators, and stator windings.
Structural adhesives in aerospace and automotive composite bonding.
Matrix resin for filament-wound pressure vessels and fiber-reinforced pipes.
Base resin for high-performance casting compounds and laminating systems.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid, low-viscosity epoxy resin |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 1,000 ppm |
| Volatiles Content | ≤ 0.5 wt% |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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