Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DER 431 Epoxy Resin

Dow DER 431 Epoxy Resin is a bisphenol-A liquid epoxy resin from Dow’s DER™ series, offering low viscosity, excellent adhesion, and superior electrical insulation. Widely used in composites, coatings, and encapsulants, it cures with amines or anhydrides to deliver high thermal stability and chemical resistance. Ideal for aerospace, electronics, and industrial applications requiring reliability and processability.
  • dow der 431 epoxy resin_aeaa435c
  • dow der 431 epoxy resin_aeaa435c

Features Of Dow DER 431 Epoxy Resin

  1. Standard liquid bisphenol-A epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity and stoichiometric formulation.

  2. Excellent adhesion to diverse substrates including metals, glass, and cured polymer surfaces.

  3. Good thermal stability and chemical resistance post-cure, particularly against weak acids and alkaline solutions.

  4. Low viscosity at room temperature enables easy handling, mixing, and impregnation in composite and coating processes.

  5. Compatible with common amine, anhydride, and phenolic hardeners for broad curing flexibility.

Typical Applications Of Dow DER 431 Epoxy Resin

  1. Structural adhesives for aerospace and automotive bonding applications.

  2. Electrical encapsulants and potting compounds for transformers, sensors, and power electronics.

  3. High-performance protective coatings for industrial steel and concrete substrates.

  4. Fiberglass-reinforced composites used in marine, wind energy, and corrosion-resistant equipment.

  5. Matrix resin in prepregs and filament-wound components requiring dimensional stability and mechanical integrity.

Specifications Of Dow DER 431 Epoxy Resin

Chemical TypeBisphenol-A based diglycidyl ether epoxy resin
Product FormClear to pale yellow liquid
AppearanceTransparent, low-viscosity liquid, free of gels or particulates
Epoxide Equivalent Weight (EEW)185–192 g/eq
Viscosity at 25°C12–16 Pa·s (12,000–16,000 cP)
Chloride Content≤ 1,000 ppm
Softening Point12–18°C
Primary ApplicationsAdhesives, coatings, composites, encapsulants, and electrical laminates


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