Standard liquid bisphenol-A epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity and stoichiometric formulation.
Excellent adhesion to diverse substrates including metals, glass, and cured polymer surfaces.
Good thermal stability and chemical resistance post-cure, particularly against weak acids and alkaline solutions.
Low viscosity at room temperature enables easy handling, mixing, and impregnation in composite and coating processes.
Compatible with common amine, anhydride, and phenolic hardeners for broad curing flexibility.
Structural adhesives for aerospace and automotive bonding applications.
Electrical encapsulants and potting compounds for transformers, sensors, and power electronics.
High-performance protective coatings for industrial steel and concrete substrates.
Fiberglass-reinforced composites used in marine, wind energy, and corrosion-resistant equipment.
Matrix resin in prepregs and filament-wound components requiring dimensional stability and mechanical integrity.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, low-viscosity liquid, free of gels or particulates |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chloride Content | ≤ 1,000 ppm |
| Softening Point | 12–18°C |
| Primary Applications | Adhesives, coatings, composites, encapsulants, and electrical laminates |
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E-mail: wangxingqiang@ericwchem.com
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