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Highly reactive liquid epoxy resin with low viscosity for excellent processability and filler wetting.
Designed for fast ambient- or low-temperature curing with compatible amine and anhydride hardeners.
Delivers superior mechanical strength, chemical resistance, and thermal stability in cured networks.
Low chloride content ensures high electrical insulation performance and corrosion resistance in electronic applications.
Consistent batch-to-batch quality supported by Daicel’s stringent ISO 9001-certified manufacturing control.
Encapsulants and potting compounds for power electronics and automotive sensors.
Electrical insulating varnishes and impregnating resins for motors and transformers.
Structural adhesives requiring rapid development of handling strength at room temperature.
Composite matrix resin for fiber-reinforced laminates in aerospace and industrial tooling.
Underfill materials for flip-chip and wafer-level packaging in semiconductor assembly.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Transparent, low-viscosity liquid, free from gels or suspended matter |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Primary Applications | Electronics encapsulation, electrical insulation, structural bonding, composite matrices |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
