High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility, suitable for high-temperature processing environments.
Superior adhesion to metals, glass, and composite substrates without requiring surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy handling, mixing, and impregnation.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
Electrical encapsulation and potting compounds for transformers and power modules.
Structural adhesives in automotive and aerospace composite bonding.
Wind turbine blade matrix resin for vacuum-assisted resin transfer molding (VARTM).
High-performance coatings for corrosion-resistant industrial flooring and tank linings.
Prepregs and laminates used in printed circuit board (PCB) base materials.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to colorless, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | 10–15°C |
| Storage Stability | ≥ 12 months at 25°C in sealed containers |
| Density (25°C) | 1.16–1.18 g/cm³ |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China