Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO KD-213 Epoxy Resin

KUKDO KD-213 Epoxy Resin is a low-viscosity, bisphenol-A-based liquid epoxy resin from KUKDO’s high-performance KD series. Designed for composites, adhesives and electrical encapsulation, it offers excellent mechanical strength, thermal stability and adhesion to diverse substrates. Compatible with standard amine and anhydride hardeners, it ensures easy processing and reliable curing. Widely used in aerospace, automotive and electronics industries.
  • kukdo kd 213 epoxy resin_6f88efbf
  • kukdo kd 213 epoxy resin_6f88efbf

Features Of KUKDO KD-213 Epoxy Resin

  1. High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.

  2. Excellent thermal stability and low volatility, suitable for high-temperature processing environments.

  3. Superior adhesion to metals, glass, and composite substrates without requiring surface priming.

  4. Low viscosity (12,000–14,000 cP at 25°C) enabling easy handling, mixing, and impregnation.

  5. Compatible with standard amine and anhydride curing agents for flexible formulation design.

Typical Applications Of KUKDO KD-213 Epoxy Resin

  1. Electrical encapsulation and potting compounds for transformers and power modules.

  2. Structural adhesives in automotive and aerospace composite bonding.

  3. Wind turbine blade matrix resin for vacuum-assisted resin transfer molding (VARTM).

  4. High-performance coatings for corrosion-resistant industrial flooring and tank linings.

  5. Prepregs and laminates used in printed circuit board (PCB) base materials.

Specifications Of KUKDO KD-213 Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA)
Product FormClear, low-viscosity liquid
AppearancePale yellow to colorless, transparent liquid
Epoxy Equivalent Weight (EEW)185–192 g/eq
Chlorine Content≤ 700 ppm
Softening Point10–15°C
Storage Stability≥ 12 months at 25°C in sealed containers
Density (25°C)1.16–1.18 g/cm³


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