Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Hexion HELOXY 68 Epoxy Resin

Hexion HELOXY 68 Epoxy Resin is a low-viscosity, bisphenol-F-based liquid epoxy resin from Hexion’s HELOXY series. Designed for high-performance composites and electrical encapsulation, it offers excellent chemical resistance, thermal stability, and adhesion. Its low viscosity enables easy processing, impregnation, and blending with accelerators or hardeners—ideal for aerospace, wind energy, and advanced electronics applications.
  • hexion heloxy 68 epoxy resin_b446c85b
  • hexion heloxy 68 epoxy resin_b446c85b

Features Of Hexion HELOXY 68 Epoxy Resin

  1. Low-viscosity liquid epoxy resin enabling excellent flow and wetting of reinforcements.

  2. High reactivity with amine and anhydride hardeners for rapid cure development at ambient or elevated temperatures.

  3. Superior adhesion to metals, composites, and concrete substrates.

  4. Good chemical resistance to alkalis, dilute acids, and solvents after full cure.

  5. Compatible with standard epoxy processing equipment and formulation techniques.

Typical Applications Of Hexion HELOXY 68 Epoxy Resin

  1. Structural adhesives for aerospace and automotive bonding.

  2. Matrix resin for fiber-reinforced composites (e.g., carbon/glass fiber laminates).

  3. Electrical encapsulation and potting compounds for power electronics.

  4. High-performance coatings for corrosion protection on steel infrastructure.

  5. Tooling resins for molds and master patterns in composite manufacturing.

Specifications Of Hexion HELOXY 68 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F
Product FormClear, low-viscosity liquid
AppearanceWater-white to pale yellow
Epoxy Equivalent Weight (EEW)175–190 g/eq
Viscosity (25°C)12–16 Pa·s
Chloride Content< 1000 ppm
Volatiles Content< 0.5 wt%
Key FeaturesLow viscosity, high reactivity, excellent adhesion, good chemical resistance


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