High molecular weight bisphenol-A based solid epoxy resin with excellent thermal stability.
Low chlorine content (< 1,000 ppm), supporting high-purity electrical and electronic applications.
Consistent particle size distribution for uniform melting and processing behavior.
Outstanding adhesion to metals, glass, and reinforced composites without additional primers.
Excellent chemical resistance to alkalis, solvents, and mild acids after full cure.
Electrical encapsulation and potting compounds for transformers, sensors, and PCB modules.
High-performance powder coatings for automotive under-hood components and industrial metal parts.
Structural adhesives in aerospace and wind energy composite bonding systems.
Reinforced thermoset composites for electrical insulators and switchgear housings.
Prepregs and filament-wound tanks requiring dimensional stability under thermal cycling.
| Chemical Type | Bisphenol-A epoxy resin (solid) |
| Product Form | Pale yellow to light amber granules or flakes |
| Appearance | Free-flowing, non-dusty solid particles |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Melting Point | 85–92 °C (determined by DSC, onset) |
| Softening Point | 78–85 °C (ring-and-ball method) |
| Chlorine Content | ≤ 1,000 ppm |
| Volatiles (150 °C, 2 h) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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