Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

NPC 901 Solid Epoxy Resin

NPC901SolidEpoxyResinbyNipponPaintChemical’sNPCseriesisahigh-purity,low-viscositybisphenol-A-basedsolidresinepoxyprepolymersuitableforelectricalinsulation,composites,andpowdercoatings.Itoffersexcellentmechanicalstrength,chemicalresistance,andalowmeltingpoint(85–95°C),ensuringstableprocessingandconsistentcuringperformance.
  • npc 901 solid epoxy resin_efd7c1ab
  • npc 901 solid epoxy resin_efd7c1ab

Features Of NPC 901 Solid Epoxy Resin

  1. High molecular weight bisphenol-A based solid epoxy resin with excellent thermal stability.

  2. Low chlorine content (< 1,000 ppm), supporting high-purity electrical and electronic applications.

  3. Consistent particle size distribution for uniform melting and processing behavior.

  4. Outstanding adhesion to metals, glass, and reinforced composites without additional primers.

  5. Excellent chemical resistance to alkalis, solvents, and mild acids after full cure.

Typical Applications Of NPC 901 Solid Epoxy Resin

  1. Electrical encapsulation and potting compounds for transformers, sensors, and PCB modules.

  2. High-performance powder coatings for automotive under-hood components and industrial metal parts.

  3. Structural adhesives in aerospace and wind energy composite bonding systems.

  4. Reinforced thermoset composites for electrical insulators and switchgear housings.

  5. Prepregs and filament-wound tanks requiring dimensional stability under thermal cycling.

Specifications Of NPC 901 Solid Epoxy Resin

Chemical TypeBisphenol-A epoxy resin (solid)
Product FormPale yellow to light amber granules or flakes
AppearanceFree-flowing, non-dusty solid particles
Epoxy Equivalent Weight (EEW)470–490 g/eq
Melting Point85–92 °C (determined by DSC, onset)
Softening Point78–85 °C (ring-and-ball method)
Chlorine Content≤ 1,000 ppm
Volatiles (150 °C, 2 h)≤ 0.3 wt%


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