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Highly reactive liquid bisphenol-A based epoxy resin with low viscosity for excellent processability.
Optimized molecular weight distribution to support fast cure kinetics with standard amine or anhydride hardeners.
Superior adhesion to metals, composites, and treated plastics in demanding structural bonding applications.
Low chloride content (< 500 ppm) ensuring enhanced corrosion resistance in protective coatings and encapsulants.
Consistent batch-to-batch reproducibility meeting stringent automotive and electronics industry quality requirements.
Structural adhesives for automotive lightweight assembly (e.g., aluminum-to-aluminum bonding).
Electronics encapsulation and potting compounds requiring high thermal stability and dielectric integrity.
High-performance composite matrix resins for wind turbine blades and aerospace secondary structures.
Corrosion-resistant industrial maintenance coatings for offshore and chemical processing equipment.
Powder coating binders delivering smooth film formation and excellent mechanical durability.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Structural adhesives, composites, encapsulation, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
