High thermal stability with glass transition temperature (Tg) exceeding 120 °C after full cure.
Excellent electrical insulation properties, suitable for high-voltage encapsulation applications.
Low viscosity (< 800 cP at 25 °C) enabling easy processing and deep penetration into complex substrates.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Superior adhesion to metals, ceramics, and composite substrates without primer.
Encapsulation of power electronics and IGBT modules.
Structural bonding in aerospace composite assemblies.
Underfill material for advanced semiconductor packaging.
Dielectric coating for high-frequency RF components.
Core material in high-performance wind turbine blade adhesive systems.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) based epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Primary Applications | Encapsulation, bonding, and potting in demanding electrical and structural applications |
| Key Features | High Tg, halogen-free, excellent moisture resistance |
| Benefits | Enhanced long-term reliability under thermal cycling and humid environments |
| Storage Condition | Store at 15–25 °C in sealed containers; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China