High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low volatile organic compound (VOC) content, supporting environmentally responsible manufacturing processes.
Superior adhesion to metals, composites, and cured polymer substrates under ambient and elevated temperatures.
Good thermal stability and low moisture absorption, enhancing long-term performance in demanding environments.
Structural adhesives for automotive and aerospace assembly.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance composite matrices in wind turbine blades and sporting goods.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
Printed circuit board (PCB) laminates and prepreg formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Adhesives, composites, electrical insulation, protective coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China