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High thermal stability with glass transition temperature (Tg) exceeding 170 °C after full curing.
Excellent chemical resistance to acids, alkalis, and organic solvents in demanding industrial environments.
Superior electrical insulation properties, ideal for high-reliability electronic encapsulation and potting.
Low ionic impurity content, minimizing risk of corrosion in microelectronic packaging applications.
Good adhesion to copper, ceramic, and FR-4 substrates without requiring specialized primers.
Encapsulation of semiconductor devices including ICs, LEDs, and power modules.
Potting compounds for automotive electronics and engine control units (ECUs).
Underfill materials for flip-chip and CSP (chip-scale package) interconnects.
Die-attach adhesives in high-temperature reflow processes.
Matrix resin in advanced printed circuit board (PCB) laminates requiring enhanced thermal performance.
| Chemical Type | Cresol-formaldehyde novolac epoxy resin |
| Product Form | Off-white to light yellow solid pellets or flakes |
| Appearance | Homogeneous granular solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Melting Point | 85–92 °C |
| Softening Point | 88–95 °C (ring-and-ball method) |
| Color (Gardner Scale) | ≤3 |
| Volatiles Content | ≤0.3 wt% (at 150 °C, 2 hrs) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
