High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) up to 135°C after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in aerospace composite assemblies and metal-to-composite joints.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced components.
High-performance potting compounds for automotive sensors and power electronics modules.
Prepreg systems requiring controlled tack, drape, and out-life for automated layup processes.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to light amber viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 180–190 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China