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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated temperature conditions.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
Potting compound for power electronics, PCB modules, and LED driver housings.
Tooling resin for low-temperature mold making and precision casting patterns.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 700 ppm |
| Softening Point | 12–16°C |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
