Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Huntsman D2000 Epoxy Resin Curing Agent

Huntsman D2000 is a high-performance aliphatic amine-based epoxy curing agent in the Araldite® series, designed for fast-curing, low-viscosity systems with excellent chemical resistance, flexibility, and adhesion to damp or contaminated surfaces—ideal for industrial coatings, flooring, and composites.
  • huntsman d2000 epoxy resin curing agent_1d0cac05
  • huntsman d2000 epoxy resin curing agent_1d0cac05

Features Of Huntsman D2000 Epoxy Resin Curing Agent

  1. Fast-reacting aliphatic amine-based curing agent for ambient and low-temperature cure.

  2. Excellent chemical resistance, particularly to solvents, acids, and alkalis after full cure.

  3. Low viscosity enables easy handling, precise metering, and superior wetting of fillers and reinforcements.

  4. Low volatility and reduced amine odor enhance workplace safety and compliance with industrial hygiene standards.

  5. Provides high glass transition temperature (Tg) and excellent mechanical properties in cured epoxy systems.

Typical Applications Of Huntsman D2000 Epoxy Resin Curing Agent

  1. Industrial flooring and heavy-duty coatings for warehouses, manufacturing facilities, and cleanrooms.

  2. Structural adhesives for automotive and transportation composite bonding.

  3. Electrical encapsulation and potting compounds for transformers, busbars, and power electronics.

  4. Repair mortars and grouts for concrete infrastructure rehabilitation.

  5. Wind turbine blade bonding and structural adhesive formulations.

Specifications Of Huntsman D2000 Epoxy Resin Curing Agent

Chemical TypeAliphatic polyamine
Product FormLiquid
AppearanceClear, pale yellow liquid
Primary ApplicationsEpoxy resin curing agent for coatings, adhesives, and composites
Key FeaturesAmbient-cure capability, low viscosity, low volatility
BenefitsImproved worker safety, enhanced interfacial adhesion, consistent cure performance
Storage StabilityStable under dry, cool conditions (≤25°C); protect from moisture
CompatibilityDesigned for use with standard bisphenol-A and bisphenol-F epoxy resins


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