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High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1 × 10¹⁴ Ω·cm).
Good thermal stability with glass transition temperature (Tg) of 125–135°C after full cure with DDS.
Electrical encapsulation and potting of transformers, inductors, and high-voltage sensors.
Structural adhesive formulation for aerospace composite bonding and metal-to-composite joints.
Matrix resin for carbon fiber and glass fiber reinforced laminates in wind turbine blades and automotive components.
Insulating coatings and busbar encapsulants in power electronics and EV battery modules.
Tooling and mold-making resins for low-volume production of precision composite parts.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels and particulates |
| Epoxy Equivalent Weight (EEW) | 172–178 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Color (Gardner) | ≤3 |
| Volatile Content (wt%) | <0.3% |
| Primary Applications | Encapsulation, structural composites, electrical insulation, high-performance adhesives |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
