SMP-105 is a premium electronic-grade epoxy resin in Kukdo’s SMP series, designed for advanced electronic packaging and precision insulation. This special high-purity modified epoxy resin features excellent electrical insulation and low curing shrinkage, ideal for industrial applications requiring reliable protection and insulation in precision electronic environments.
High-purity formula - Low impurity content, suitable for precision electronic applications
Excellent electrical insulation - Stable dielectric properties, ensuring insulation safety of electronic components
Low curing shrinkage - Dimensional stability after curing, reducing internal stress of precision devices
Good compatibility - Suitable for various electronic packaging curing agents and filler systems
Easy processability - Fluidity adapts to precision pouring, facilitating uniform coating
Industrial protective coatings - For anti-corrosion painting of ships, pipelines in harsh environments
Composite material molding - Suitable for filament winding and laminate composite preparation
Structural adhesives - High-strength bonding of industrial components
Electronic potting - Insulation potting protection of electronic components
Floor coatings - Wear-resistant floor materials for industrial plants and parking lots
| Epoxy Equivalent Weight (EEW) | 185 - 205 | g/eq |
| Viscosity | 2,500 - 4,500 | cps @ 25°C |
| Color | ≤ 3 | Gardner (G) |
| Hydrolyzable Chlorine | ≤ 200 | ppm |
| Volume Resistivity | ≥ 1.0 × 10¹⁴ | Ω·cm |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China