High-purity bisphenol-A based epoxy resin with low chloride content for enhanced electrical insulation performance.
Optimized molecular weight distribution ensuring excellent flow control and reduced gel time in casting and encapsulation processes.
Superior thermal stability with glass transition temperature (Tg) up to 125 °C after full curing with standard amine hardeners.
Low viscosity at elevated temperatures (≈8,500–9,500 cP at 120 °C), facilitating bubble-free impregnation and deep-section filling.
Consistent batch-to-batch reproducibility certified under ISO 9001 manufacturing controls.
High-voltage electrical insulation systems for dry-type transformers and reactor windings.
Encapsulation of power electronics modules including IGBTs, SiC inverters, and EV onboard chargers.
Structural potting compounds for railway traction converters and industrial motor stators.
Core material in vacuum-pressure impregnation (VPI) systems for rotating machine insulation.
Base resin for flame-retardant formulations meeting UL 94 V-0 when compounded with appropriate additives.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Off-white to pale yellow solid flakes |
| Appearance | Free-flowing crystalline flakes, no visible impurities |
| Epoxy Equivalent Weight (EEW) | 485–495 g/eq |
| Softening Point | 78–82 °C |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | ≥ 12 months at 25 °C in sealed original packaging |
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E-mail: wangxingqiang@ericwchem.com
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