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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic impurity content for enhanced electrical insulation performance.
Optimized viscosity (12,000–16,000 cP at 25°C) for improved processability in casting and encapsulation.
Superior adhesion to metals, glass, and composite substrates after proper curing.
Low chlorine content (< 800 ppm), meeting stringent requirements for electronic-grade applications.
Electrical insulating encapsulants for power modules and IGBTs.
High-voltage potting compounds in transformers and bushings.
Structural adhesives for aerospace composite bonding.
Prepreg matrices in high-performance printed circuit boards (PCBs).
Coating resins for corrosion-resistant industrial linings.
| Chemical Type | Bisphenol A epoxy resin (liquid) |
| Product Form | Clear, amber-colored viscous liquid |
| Appearance | Homogeneous, transparent, free of gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
