High purity bisphenol A-based epoxy resin with consistent epoxide equivalent weight (EEW) for reliable reactivity control.
Low viscosity at room temperature, enabling excellent processability in coating, adhesive, and composite manufacturing.
Superior thermal stability and mechanical strength after curing with standard amine or anhydride hardeners.
Excellent adhesion to metals, composites, and cured polymer substrates—ideal for demanding structural bonding applications.
Low chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation and metal-coating systems.
High-performance protective coatings for offshore platforms, pipelines, and industrial steel structures.
Structural adhesives in automotive and aerospace assembly requiring high shear strength and fatigue resistance.
Electrical insulation and potting compounds for transformers, busbars, and medium-voltage power electronics.
Matrix resin for fiber-reinforced composites used in wind turbine blades and sporting goods.
Base resin for UV-curable and hybrid (UV/thermal) coating formulations in industrial wood and metal finishing.
| Chemical Type | Bisphenol A Diglycidyl Ether (DGEBA) |
| Product Form | Clear, pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid without sediment |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–18°C |
| Hydrolyzable Chloride | ≤ 100 ppm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China